Thermal Conductive Compound – MAG TC 01

MAG TC 01 is one of the grades of our Thermally Conductive compounds. These compounds are grease in appearance. These compounds are heavily loaded organic and inorganic heat conductive oxides and metal oxides in Siloxane matrix. Designed formulation of compound provides high thermal conductivity, low bleed and high temperature stability. This compound helps to maintain a positive heat sink seal to improve heat transfer from the electrical/electronic device to the heat sink. This compound increases the overall efficiency of the device. Continuous efforts on for designing electronic devices to produce more and more sophisticated and smaller sized is on. Here, more heat is generated in smaller area of device. Thermal management in such electronic devices is very important. A cooler device allows for more efficient operation and better reliability over the life of the device. In such cases, thermally conductive compounds are of major concern because this helps as a thermal “bridge” for removing heat from a heat source to the ambient atmosphere. These materials have properties such as low thermal resistance, high thermal conductivity and can achieve thin Bond Line Thicknesses (BLT) which can help to improve the transfer of heat away from the device.