Thermal compound
MAG thermal compound is single component; whitish, non-drying, non-curing, thermally conductive paste is designed to efficiently transfer heat away from a heat generating component. For electrical or electronics applications, it is used to thermally bond a component with a mechanical heat sink. The compound fills the gaps between the heat sink and heat generating components. These compounds are grease in appearance. These compounds are heavily loaded heat conductive metal oxides in Siloxane matrix. Designed formulation of compound provides high thermal conductivity, low bleed and high temperature stability. This compound helps to maintain a positive heat sink seal to improve heat transfer from the electrical or electronic devices to the heat sink. This compound increases the overall efficiency of the device.
Types and selection criteria
| Product | Important properties | Suggested applications | |
| MAG TC01 | MAG TC01 is a Thermal Conductive Compound and is suitable for use as a thermal interface material for lighting assemblies, consumer electronics, power supplies and power components for automotive and transportation assemblies. |
· Applicable for the electrical or electronic appliances. · Lighting and general application <20 W |
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| MAG TC01Z | MAG TC01Z is a Thermal Conductive Compound used as a thermal interface material for lighting and general purpose assemblies, consumer electronics, power supplies and power components for automotive and transportation assemblies. |
· Lighting assemblies, consumer electronics, power supplies and power components for automotive and transportation assemblies. · Lighting and general application <30 W
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| MAG TC02 | MAG TC02 is a Thermal Conductive Compound and is applicable for use as a thermal interface material for lighting, electronics, computer microprocessor, power supplies and power components for automotive and transportation assemblies. |
· Lighting, electronics, power supplies, computer micro-processors and power components for automotive and transportation assemblies. · Lighting and general application<50 W |
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| MAG TC02Z | MAG TC02Z is a Thermal Conductive Compound and is applicable for use as a thermal interface material for microprocessors of electronic devices, power supplies and power components for automotive and transportation assemblies. |
· Lighting, electronics, power supplies, computer micro-processors and power components for automotive and transportation assemblies. · Lighting and general application<70 W |
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| MAG TC03 | MAG TC03 is a Thermal Conductive Compound and is suitable for use as a thermal interface material for high performance devices e.g. high power lighting systems, power transistors, CPUs, GPUs and street lights. | · High performance Devices (power transistors, CPUs, GPUs) and street lights (>70 W) | |
| MAG TC03Z |
MAG TC03Z is a Thermal Conductive Compound and is suitable for use as a thermal interface material for high performance devices e.g. high power lighting systems, power transistors, CPUs, GPUs and street lights. Heat dissipation is very high and also keeps system efficient in performance. |
· Heat dissipation · High performance devices power transistors, CPUs, GPUs, microprocessors and street lights (>90 W) |
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Benefits and Features
- Single component; whitish, non-drying, non-curing
- Designed to efficiently transfer heat away from a heat generating component
- Fills the gaps between the heat sink and heat generating components
- Loaded heat conductive metal oxides in Siloxane matrix
- High thermal conductivity, low bleed and high temperature stability
- Improves the overall efficiency of the device
Available Pack Size
- MAG TC 01- 1 kg and 5 kg
- MAG TC 02- 1 kg and 5 kg
- MAG TC 03- 1 kg and 5 kg
For Lighting Industries
For CPU Cooling
MAG CPU 106
MAG CPU 206
